"Job Description •Responsible for releasing new silicon products which meet cost, quality, and requirements at release to production and beyond •Conducting the DFT/DFR/DFM plan - working closely with the local and the Far East ASIC vendor VLSI teams. •Responsible for leading the implementation of DFT. •Responsible for test plan definition, hardware requirement at Wafer Sort & Final-Test which include board design of all H/W including FT boards, Probe Cards, HTOL Board and HAST. •Define & execute AC/DC characterization plan over PVT •Define & execute the qualification & reliability planning •Failure analysis of production units and RMA Job Requirements: -Electrical Engineer •Prove track recoded with silicon mass production •In-depth knowledge of IC production flow from wafer fabrication through wafer sort and packaging to final tests •Good knowledge and understanding of semiconductor production flow •More than 4 years experience in silicon/fab product/test engineering •Past experience with IC productization process, and transfer to high volume manufacturing stage. •Deep knowledge in Release To Production flow and definitions •Deep Knowledge in characterization flow •Knowledge on packaging technology including packages types, assembly process including package qualifications. •Knowledge on failure analysis and silicon reliability. •Knowledge in board design/system •Experience in working with lab equipment / chip validation – Advantage •Good communication skills and data analysis, willing to learn "
לפרטים הצטרף לקבוצה הגדולה בארץ לחיפוש עבודה